Bergquist Hi-Flow 225UT導熱絕緣相變化材料

材料生產(chǎn)商：美國貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

Hi-Flow 225UT可供規(guī)格：

厚度： 0.077mm  0.127mm

片材： 279.4 mm*304.8 mm

卷材：  279.4mm*76.2 m

相變化溫度：55℃

導熱系數(shù)：0.7W/m-K

表面粘性：雙面自帶黏性

顏色：黑色

Hi-Flow 225UT應用材料特性：

壓敏相變化導熱界面材料，具有天然粘性的55℃相變化復合物，高可視度的保護膜拉片

Hi-Flow 225UT材料說明：

Hi-Flow 225UT是一款設計應用于高性能處理器的發(fā)熱元器件和散熱器之間導熱的壓敏界面材料，它是一種具有天然粘性的55℃相變化復合物，該材料背面有PET離型膜，正面附有高可視度的保護膜拉片。一旦達到55℃的相變化溫度，Hi-Flow 225UT立刻潤濕導熱界面，流動的特性帶來最低的熱陰，裝配時需要一定的壓力讓材料流動，流動時涂層不會滴漏。

Hi-Flow 225UT典型應用：

彈片/扣具安裝

獨立的功率半導體和模塊

Hi-Flow 225UT技術優(yōu)勢分析：

可按客戶尺寸模切，僅限于正方形和長方形.提供經(jīng)過模切的卷材制品，啤半穿、除廢料，附有拉片（不能有孔）

Hi-Flow? 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow? 225UT is a thermally conductive 55°C phase change composite with inherent tack. The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs. Above its phase change temperature,

Hi-Flow? 225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow. Hi-Flow? 225UT coatings will resist dripping.

Application Methods

 1. Hand-apply Hi-Flow? 225UT to a room- temperature heat sink. The Hi-Flow? 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly.